C1608X7R2A105KT0A0E 代理TDK
-
尺寸
| 長度(L) |
- 1.60mm +0.20,-0.10mm
|
| 寬度(W) |
- 0.80mm +0.20,-0.10mm
|
| 厚度(T) |
- 0.80mm +0.20,-0.10mm
|
| 端子寬度(B) |
- 0.20mm Min.
|
| 端子間隔(G) |
- 0.30mm Min.
|
| 推薦焊盤布局(PA) |
- 0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
|
| 推薦焊盤布局(PB) |
- 0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
|
| 推薦焊盤布局(PC) |
- 0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
|
電氣特性
| 電容 |
- 1μF ±10%
|
| 額定電壓 |
- 100VDC
|
溫度特性  |
- X7R(±15%)
|
| 耗散因數(shù) (Max.) |
- 5%
|
| 絕緣電阻 (Min.) |
- 100MΩ
|
其他
| 溫度范圍 |
- -55～125°C
|
| 焊接方法 |
- 流體
- 回流
|
| AEC-Q200 |
- NO
|
| 包裝形式 |
- 編帶 (180mm卷筒)
|
| 包裝個(gè)數(shù) |
- 4000pcs
|
